Contents:
Chap. INT : Introduction
Chap. ICF : Introduction to IC Fabrication
Chap. SB : Semiconductor Basics
Chap. WM :Wafer Manufacturing
Chap. TP : Thermal Processes
Chap. PL : Photolithography
Chap. PB : Plasma Basics
Chap. I2 : Ion Implantation
Chap. EC : Etch
Chap. CVD : CVD and Dielectric Thin Film
Chap. MZ : Metallization
Chap. CMP : Chemical Mechanical Polishing
Chap. PI : Process Integration
Chap. CMOS : CMOS Processes

Text book:
Hong Xiao, “Introduction to Semiconductor Manufacturing Technology”, 2001, Prentice Hall

Midterm and Final Examinations: 60 % (closed book)
Chapters Tests: 40 % (open book)
This course was the basic course for an EE background undergraduate student. One should know what happened in the IC chips. The fabrication process of semiconductor devices including many matching equipments are introduced in this course. After learning this knowledge, one can figure out how important the process engineers are for the IC industry. It was suggested the students in the areas of chemical, mechanical, material, and of course electrical engineering have to take this course before entering graduate study or industry.